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Monday October 5, 2009
DrStockPick.com Stock Report!
Honeywell (NYSE: HON) Technology Solutions Inc. (HTSI) announced today that it has won a five-year contract with the U.S. Army Prepositioned Stocks-3 (APS-3) Afloat Program, which ensures Army ships are stocked and available for deployment to combat zones.
Patriot Scientific Corporation (OTC Bulletin Board: PTSC) announced today three new MMP(TM) Portfolio licensees less than three weeks after the USPTO announced its decision to affirm the validity of US’336, the most widely recognized patent in the MMP Portfolio. The new licensees include Harman International, TPV Technology, and Textron Inc., and will result in both upfront and future payments.
Tongxin International Ltd. (Nasdaq: TXIC), a China-based manufacturer of engineered vehicle body structures and stamped parts for the commercial automotive industry, announced today that it will present at the Roth China Conference, to be held October 12-14, 2009, at the Fontainebleau Resort in Miami Beach, FL.
Raytheon Company (NYSE: RTN) has won a contract to improve, deliver and maintain an advanced combat training program for U.S. Armed Forces and coalition partners in Kuwait.
CA, Inc. (Nasdaq: CA) today announced that Dave Hansen, CA corporate senior vice president and general manager of CA’s Security Management business unit, will deliver a keynote speech at the RSA Conference Europe 2009 on Wednesday, Oct. 21, at 1 p.m. BST in the Hilton London Metropole.
Novellus Systems (Nasdaq: NVLS) today announced that it has developed a manufacturing process to extend the company’s SPEED Max shallow trench isolation (STI) application to the 32 nm technology node. The new process technology takes advantage of the dynamic profile control (DPC(TM)) of the SPEED Max high density plasma chemical vapor deposition (HDP-CVD) platform. By tailoring the deposition, etch, and sputter-to-deposition (S/D) ratio, Novellus engineers have developed a single-pass, sequential profile modulation technique using fluorine (SPM-F) to fill 32 nm features. The process meets the stringent integration requirements of STI logic applications and the productivity required for high volume manufacturing.
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